Application: Test PCB pad solderability to verify surface treatment quality and avoid poor soldering issues in production. (New Machine)
| Parameter | Specification |
|---|---|
| Application | Melts lead-free solder wire for wave soldering and manual soldering in PCB and copper-clad laminate industries |
| Temperature Control System | Digital display with microcomputer PID self-tuning circuit, using imported Omron intelligent controller |
| Temperature Range | Room temperature to 400℃ |
| Heating Element | High-temperature ceramic heater (long service life, safe and reliable) |
| Pot Material | Titanium alloy (corrosion-resistant, high-temperature resistant, anti-oxidation) |
| Internal Dimensions | L200×W250×H80mm |
| Timing Range | 0–9999 seconds (supports setting in seconds, minutes, or hours) |
| Compliance Standard | IPC-TM650 2.4.13-1998 |










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