PCB Prepreg Gel Time Tester For Resin Curing Performance Test

Gelation Time Tester

Designed per IPC-TM-650 2.3.18 standard, for testing prepreg and resin gelation time
Comes with complete test tools: sampling spoon, filter screen, and wax
Digital PID controller ensures precise gel pool temperature control with ±0.5℃ accuracy
Hot plate temperature: ±0.5℃ accuracy, 0.1℃ resolution, max working temperature 230℃
Timer range: 0-999.9 seconds, supporting accurate recording of gelation process

Application: Conduct incoming QC inspection for raw prepreg materials in multilayer PCB production lines. (New Machine)

Parameter	Specification
Model	N01
Compliance Standard	Designed per IPC-TM-650 2.3.18 for PCB material testing
Temperature Control System	Digital PID controller, ±0.5℃ accuracy, 0.1℃ resolution
Max Working Temperature	230℃
Timer Range	0–999.9 seconds
Hot Plate Gel Pool Size	φ20.0 mm
Included Accessories	Sampling spoon, filter screen, and wax
Core Application	Tests gelation time of prepreg/resin to verify PCB lamination material performance