Prepreg Resin Flow Tester

Complies with IPC-TM-650 2.3.17 standard, designed for testing prepreg resin flow properties
Supports both square and circular punch dies for different sample preparation needs
Driven by compressed air, with a maximum pressure capacity of 2.0T
Equipped with PID temperature control for stable heating, with an accuracy of ±2.0℃
Hot plate size: 200×200mm, working temperature up to 200℃, thickness 40mm
Assembled with high-quality imported components for reliable and durable operation

Application: Verify resin flow stability of prepreg batches to prevent glue overflow during PCB pressing. (New Machine)

Parameter	Specification
Model	JL01
Compliance Standard	IPC-TM-650 2.3.17
Core Application	Test resin flow percentage of PCB prepreg for lamination quality control
Max Pressure	2.0 Tons (pneumatic driven)
Hot Plate Size	200×200mm
Hot Plate Thickness	40mm
Max Working Temperature	200℃
Temperature Control	PID control, accuracy ±2.0℃
Power Consumption	1.1 kW per plate, total 2.2 kW
Sample Preparation	Compatible with square and circular punch dies
Key Features	Compact design, assembled with high-quality imported components