Application: Widely deployed in PCB production lines for process monitoring after ething, drilling, plating procedures (New Machine)
| Στοιχείο | Specification |
|---|---|
| Measuring Principle | Eddy current |
| Measuring Range | 0.04–4.0 mil (0.5–102 µm) |
| Ακρίβεια | ±3% (using standard reference foils) |
| Resolution | 0.01 mil (0.1 µm) |
| Minimum Hole Diameter | 35 mil (0.9 mm) |
| Maximum Testable Board Thickness | 0.75 mm (30 mil) |
| Display | Backlit LCD screen |
| Power Supply | Built-in rechargeable 9V Li-ion battery |
| Data Functions | 1500 readings memory, USB output, SPC analysis |
| Temperature Compensation | Automatic temperature compensation |
| Calibration Method | Calibration with standard reference foils |
| Dimensions & Weight | 130×70×30 mm, approx. 210 g |
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