Application: It examines PCB copper foil and solder mask microstructure to evaluate material performance and process stability. (New Machine)
| パラメータ | Specification |
|---|---|
| Observation Head | Wide-field hinge trinocular head, erect image |
| Optical Technology | Semi-apochromatic + multi-layer coating, sharp imaging |
| Stage Size & Travel | 4-inch stage, 158×158 mm travel |
| Converter Design | Precision bearing, smooth rotation, high repeatability |
| Stand Structure | Safe, stable industrial structure |
| Microscope Body | Low center of gravity, high rigidity, shock-resistant |
| Power Supply | Built-in 100–240V wide-voltage transformer |
| Camera System | 3.1MP color Sony sensor (custom options available) |
| Control System | Custom industrial PC for stable operation |
| Observation Modes | Brightfield/Darkfield/Polarized/Transmitted light |
| Metallurgical Objectives | 5X/10X/20X/50X (100X optional), long working distance |










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