Application: XRF Plating Thickness Tester precisely measures ENIG gold and nickel coating thickness for FPC and rigid PCB quality inspection. (New Machine)
| 매개변수 | Specification |
|---|---|
| Product Use | High-precision non-vacuum instrument for plating analysis, suitable for PCB, hardware, jewelry, semiconductors, automotive parts, etc. |
| Coating Analysis | 1–5 layers (excluding base layer); Element range: Al to U |
| Sample Types | Solid, liquid, and powder samples supported |
| Analysis Modes | Unknown sample scanning; Standardless qualitative & semi-quantitative analysis |
| Operation Platform | Fully automatic with laser positioning & multi-point auto-measurement |
| Core Configuration | SDD detector, long-life X-ray tube, SPELLMAN high-voltage power supply |
| 해상도 | 125 ± 5 eV |
| Interfaces | Integrated coating analysis & alloy composition analysis interfaces |
| Report Export | Direct printing; exportable to PDF / Excel formats |
| Sample Chamber Size | 80mm (W/D) × 90mm (H) |
| Test Precision | 0.001 μm |
| Measurement Time | 10–30 seconds |
| Collimator Options | 0.05×0.2mm square; round: 0.1, 0.2, 0.3, 0.5, 1, 4mm |
| Key Advantages | Non-destructive, fast testing, high stability, easy operation |
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