ПЕЧАТНАЯ ПЛАТА LDI

High-Precision Imaging
PCB LDI systems use laser technology to directly expose the photoresist layer on the PCB, providing high-resolution patterning with fine lines and tight tolerances. This ensures the accurate replication of complex circuit designs.
Reduced Production Costs
By eliminating the need for photomasks and traditional exposure equipment, PCB LDI significantly reduces material costs and setup time. It also minimizes errors, leading to fewer reworks and lower overall production costs.
Faster Turnaround Times
LDI systems provide faster imaging and processing speeds compared to traditional methods, accelerating the PCB manufacturing process. This is particularly advantageous for high-volume or time-sensitive production runs.
Enhanced Design Flexibility
With PCB LDI, manufacturers can easily switch between different designs without needing new masks, enabling greater flexibility in producing low to medium-volume runs of different PCB designs. It also allows for more intricate and complex circuit patterns that are difficult to achieve with traditional photolithography.

Application: Laser Direct Imaging Machine for PCB (Orbotech Brand）

Артикул	Размер
Модель:	Paragon-SM 20
Resolutions:	8000 точек на дюйм
Throughput*(max. prints/hour 18" x 24")：	@10mJ/cm2 SR: 160 @100mJ/cm2 SR: 80
Minimum Feature Size:	1mil
Edge Roughness:	+/-0.1mil
Exposure Wavelength:	UV Range, 355nm, 16W
Energy Range (mJ/cm2):	10-2200
Positioning Accuracy (FTG):	+/-0.5mil
Side-to-Side Registration:	1mil
Max. Substrate Size:	25*32''
Max. Exposure Area:	24*32''
Substrate Thickness:	0.001''-0.315''
Applications:	Solder mask/Inner layers and outer layers/Sequential build-up layers/Flex and Rigid-Flex PCBs