Laser Blind Hole Inspection Machine

Performs comprehensive defect inspection and dimensional measurement on laser-drilled holes
Adopts ultra-high resolution line-scan imaging system with fast scanning speed, enabling full inspection of all blind vias on HDI boards
Equipped with multiple analysis tools including target diagrams and distribution maps
Customized for laser blind vias, detecting defects like aperture size, residual glue inside holes, and missing holes

Application: Identify micro hole defects and blind via abnormalities for high-precision PCB production quality control. (New Machine)

Артикул	Specification
Модель	KI-730
Equipment Size	L2190W1400H1820mm
Data Format	Excellon II, Hitachi, S&M
Max Board Size	730*660mm (28")
Lens Resolution	3 μm
Detectable Aperture Range	30–300 μm
Detectable Hole Depth Range	60–200 μm
PCB Thickness Range	0.025–7.5mm
Suitable Material	Copper foil after micro-etching
Applicable Board Type	Conformal, DLD, ABF, UV
Detection Speed	43s / 16.3"×20.3" panel
Max Detectable Holes	< 2,000,000 holes per panel
Detection Categories	Missing holes, misalignment, copper window vs. PAD size deviation, thin film, foreign matter, residual glue, hole position accuracy
Review & Analysis Functions	Full true-color imaging, offline analysis, XY coordinates, aperture histogram, defect distribution & classification
Operating System	Windows 10
Power Supply	AC 380V, 3P, SOHZ, 3.0 kW, 10A
Air Pressure	5kg/cm² (0.5MPa)
Defect Confirmation	Simultaneous display of CAM image and actual board defect image