Immerison 镀金生产线

uperior Corrosion Resistance
ENIG plating provides excellent protection against corrosion, particularly oxidation, due to the combination of electroless nickel and immersion gold. This makes it ideal for applications where long-term reliability and performance are essential.
Enhanced Solderability
The smooth, gold surface of ENIG plating ensures excellent solderability. This is critical for achieving strong, reliable solder joints in PCBs, particularly in fine-pitch components or complex designs where precision is paramount.
Flat and Uniform Surface
ENIG plating results in a highly flat and uniform surface, which is essential for high-density interconnect (HDI) boards. The consistency of the surface finish improves the quality of the final product, especially for small, fine-pitch components.
Good Electrical Conductivity
The electroless nickel layer in ENIG plating offers good electrical conductivity, while the gold layer enhances performance in high-frequency applications. This makes ENIG plating a preferred choice for high-performance and advanced electronic applications, such as telecommunications and aerospace.