Application: Detect multi-layer PCB internal defects, layer shifts and vias (New Machine)
| 项目 | Specification |
|---|---|
| Device Name | X-RAY Inspection Machine |
| 模型 | KI-6 |
| Equipment Size | L930*W730*H1200mm |
| Weight | 150KG |
| 电源 | 220V/10A |
| Maximum Substrate Size | 1000*800mm |
| Maximum Substrate Thickness | 10mm (Copper thickness varies) |
| Highest Resolution | 201p/mm |
| X-Ray Tube Maximum Output | 50KV/1mA |
| X-Ray Leakage | <0.5 μSv/h |
| Cooling Method | Internal Oil + External Air Cooling |
| Image Processor | 2nd Gen II + CCD |
| Maximum Effective Field of View | φ 25mm |
| Zoom Method | 10x optical magnification |
| Software Auxiliary Functions | Image saving, measurement of line spacing, line width, diameter, etc., and image adjustment functions |
| 售后服务 | Provide 24-hour tracking support |
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