Application: TMA thermomechanical analysis tests PCB substrate CTE to evaluate dimensional stability under temperature changes. (New Machine)
| 参数 | Specification |
|---|---|
| Core Function | Evaluates thermal expansion/contraction, creep, stress relaxation, and stress-strain behavior |
| Sample Furnace | Quartz/Metal (TMA7100); Alumina (TMA7300) |
| 温度范围 | -170°C to 600°C (TMA7100) |
| Measurement Range | ±5mm |
| Sensitivity | 0.01μm |
| Load Range | ±5.8 N |
| Scan Rate | 0.01 to 100 °C/min |
| Auto Measurement | Automatic sample length measurement |










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