Application: Used for XRF Plating Thickness Fluorescence Spectrometer of ENIG nickel and gold layers on rigid PCBs. (New Machine)
| Parameter | Specification |
|---|---|
| Core Application | Coating/plating thickness measurement; PCB/FPC plating analysis (Au, Ni, Ag, Sn, Pd-Au) |
| Max. Layers Detected | Up to 5 layers |
| Thin Coating Precision | Measures <1uin (0.025μm); analyzes 0.2–0.5uin gold layers |
| Alloy Analysis | Optional simultaneous alloy composition analysis |
| Sample Stage | Slotted large-format fully automatic moving stage: 620×525mm (L×W) |
| Positioning & Measurement | Laser positioning; continuous automatic multi-point programmable measurement |
| Collimator Options | 1, 6, or 7 collimator systems available |
| Sample Types | Solid, liquid, and powder samples |
| Analysis Modes | Unknown sample scanning; standardless qualitative & semi-quantitative analysis |
| Operation & Speed | Easy to use; fast results (20–40 seconds); high performance & stability |
| Detector | Standard German Si-Pin detector; optional SDD detector |
| Software Features | Supports standardless analysis |
| Power Control | No warm-up required; direct power-on/off to reduce component wear |
| Element Range | Al(13) – U(92) |
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