STA Simultaneous Thermal Analyzer for PCB Material Testing

Simultaneous Thermal Analyzer

Integrated Testing: The STA (Simultaneous Thermal Analyzer) performs both DSC and TGA measurements in a single unit
Comprehensive Analysis: It evaluates heat resistance, decomposition temperature, and component ratios via TGA, plus specific heat capacity via DSC
Temperature Range: Ambient to 1,100°C (up to 1500°C for high-temperature models)

Application: Simultaneous Thermal Analyzer tests PCB substrate thermal decomposition and weight loss to evaluate high temperature stability. (New Machine)

Paramètres	Specification
Core Function	Simultaneous TGA & DSC measurement in one unit
Measurement Principle	Digital horizontal differential balance
Temperature Range	Ambient to 1,100°C (up to 1500°C for high‑temp model)
TG Baseline Drift	< 10 µg
TG Baseline Stability	< 10 µg
Temperature Precision/Accuracy	±0.07°C / ±0.2°C
DSC & Specific Heat	Integrated DSC function; optional specific heat capacity measurement