Application: Applied for real-time thickness detection of multilayer PCB panels in lamination production line with high precision. (New Machine)
| パラメータ | Specification |
|---|---|
| Measurement Range | 0.2mm ~ 3.2mm (PCB thickness) |
| Panel Size | 320–620mm (customizable) |
| 精度 | ±0.006mm |
| Testing Speed | 8–12 panels/min |
| Test Points | Configurable: 3/5/9 points |
| System Configuration | 3 Synchronized laser inspection heads |
| Auto-Adjustment | Auto-positioning for varying panel length & width |
| Unit Options | mm/μm/mil (metric/imperial conversion) |
| Data Management | Lot/part number tracking; CPK & yield analysis |
| Compatibility | Synchronizes with copper thickness testers; supports NG signal output for unloaders |
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