Application: Conduct incoming QC inspection for raw prepreg materials in multilayer PCB production lines. (New Machine)
| パラメータ | Specification |
|---|---|
| モデル | N01 |
| Compliance Standard | Designed per IPC-TM-650 2.3.18 for PCB material testing |
| Temperature Control System | Digital PID controller, ±0.5℃ accuracy, 0.1℃ resolution |
| Max Working Temperature | 230℃ |
| Timer Range | 0–999.9 seconds |
| Hot Plate Gel Pool Size | φ20.0 mm |
| Included Accessories | Sampling spoon, filter screen, and wax |
| Core Application | Tests gelation time of prepreg/resin to verify PCB lamination material performance |










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