Application: Performs precise target drilling to ensure accurate layer alignment for multi-layer PCB production. (New Machine)
| 항목 | Specification |
|---|---|
| 모델 | KI-100 |
| Equipment Size | L2246*W1600*H1638mm |
| Weight | 2800KG |
| Operation Mode | See-Target Drilling, Line Compensation Drilling, Face Compensation Drilling |
| Repeated Measurement Error | Within 10 μm |
| X-Ray Leakage | ≤0.5 μSv/h (max. at machine surface) |
| X-Ray Generator | 50kV/1.0mA or 80kV/0.5mA integrated tube (80kV version for thick copper plates optional) |
| See-Target Drilling Accuracy | ±10 μm |
| Distance Compensation Accuracy | ±15 μm |
| Processing Dimensions | Max: 750*620mm Min: 300*210mm |
| Thickness Range | 0.2–8.0mm |
| Drill Bit Diameter | 0.8–5.0mm |
| CCD Effective Size | 10mm*10mm |
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