Handheld Hole Wall Copper Thickness Gauge T65

Fast, non-destructive hole wall plating thickness measurement
Adjustable calibration factors and compensation values
Automatic temperature compensation for enhanced accuracy
Minimum testable hole diameter: 35 mil (899 µm)
Max testable board thickness: 0.75 mm (30 mil)
Accuracy: ±3% (with standard foils); ±5% (on actual products)

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Application: Conduct non-destructive thickness inspection for plated through holes in rigid PCB mass production and quality control. (New Machine)

Артикул	Specification
Name	Handheld Hole Copper Thickness Gauge
Measuring Range	1–102 μm
Точность	±3% (std foil) / ±5% (actual PCB)
Minimum Resolution	0.01 mil (0.1 μm)
Core Function	Fast non‑destructive hole copper thickness testing
Power Supply	Built‑in rechargeable Li‑ion battery
Display	Backlit color LCD display
Units	Unit switchable: mil/μm
Calibration	Calibrated with standard foils; adjustable factors
Temp. Compensation	Automatic temperature compensation
Data Features	Data export/real‑time transmission, SPC analysis
Min. Hole Dia.	35 mil (899 μm)
Max. Board Thickness	0.75 mm (30 mil)