Application: Simultaneous Thermal Analyzer tests PCB substrate thermal decomposition and weight loss to evaluate high temperature stability. (New Machine)
| Parámetro | Specification |
|---|---|
| Core Function | Simultaneous TGA & DSC measurement in one unit |
| Measurement Principle | Digital horizontal differential balance |
| Temperatura | Ambient to 1,100°C (up to 1500°C for high‑temp model) |
| TG Baseline Drift | < 10 µg |
| TG Baseline Stability | < 10 µg |
| Temperature Precision/Accuracy | ±0.07°C / ±0.2°C |
| DSC & Specific Heat | Integrated DSC function; optional specific heat capacity measurement |










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